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Publication name
Authors
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Year

2156

Laakso, Harri
Centre photographique d'Ile de France CPIF2017

Low-temperature SLID-TSV Interconnects for 3D (MEMS) Packaging

Peer-reviewed
Open access
DOI
10.1109/TCPMT.2025.3528519
Emadi, Fahimeh; Liu, Shenyi; Vuorinen, Vesa; Paulasto-Krockel, Mervi
IEEE Transactions on Components, Packaging and Manufacturing Technology2025

Facilitating Small-Pitch Interconnects with Low-Temperature Solid-Liquid Interdiffusion Bonding

Peer-reviewed
Open access
DOI
10.1109/TCPMT.2025.3540665
Golim, O.; Vuorinen, V.; Paulasto-Krockel, M.
IEEE Transactions on Components, Packaging and Manufacturing Technology2025

Complex Permittivity Characterization of Low-loss Slabs Using Time-gating Technique

Peer-reviewed
Open access
DOI
10.1109/TCPMT.2025.3551958
Xue, Bing
IEEE Transactions on Components, Packaging and Manufacturing Technology2025

Optical Setup for Laser-Assisted Bonding with Through-Silicon Microscopy Capabilities

Peer-reviewed
Open access
DOI
10.1109/TCPMT.2025.3557118
Vlasov, Aleksandr; Uusitalo, Topi; Lepukhov, Evgenii; Viheriälä, Jukka; Guina, Mircea
IEEE Transactions on Components, Packaging and Manufacturing Technology2025

Comparison and Optimization of SLID Bonding for Die-attach on Various Substrate Types in Power Module Packaging Applications

Peer-reviewed
Open access
DOI
10.1109/TCPMT.2025.3626444
Liu, Shenyi; Vuorinen, Vesa; Schuh, Jannis; Albrecht, Jurgen; Paulasto-Krockel, Mervi
IEEE Transactions on Components, Packaging and Manufacturing Technology2025

Cryogenic characterization of LTCC material in Millimeter-Wave Frequencies

Peer-reviewed
DOI
10.1109/TCPMT.2024.3400028
Vargas-Millalonco, Felipe; Martinez-Ledesma, Miguel; Reeves, Rodrigo; Rodriguez, Rafael; Paaso, Jask...
IEEE Transactions on Components, Packaging and Manufacturing Technology2024

Novel low-temperature interconnects for 2.5/3D MEMS integration: demonstration and reliability

Peer-reviewed
Open access
DOI
10.1109/TCPMT.2024.3430061
Emadi, Fahimeh; Vuorinen, Vesa; Liu, Shenyi; Paulasto-Krockel, Mervi
IEEE Transactions on Components, Packaging and Manufacturing Technology2024

In-line Vector Modulator Integration in Dielectric-filled Waveguide

Peer-reviewed
Open access
DOI
10.1109/TCPMT.2023.3244865
Haarla, Jaakko; Ala-Laurinaho, Juha; Lahti, Markku; Varonen, Mikko; Kantanen, Mikko; Holmberg, Jan; ...
IEEE transactions on components, packaging and manufacturing technology2023

Machine Vision System Utilizing Black Silicon CMOS Camera for Through-Silicon Alignment

Peer-reviewed
Open access
DOI
10.1109/TCPMT.2022.3225051
Vlasov, Aleksandr A.; Aydin, Alp E.; Uusitalo, Topi; Viheriala, Jukka; Guina, Mircea
IEEE Transactions on Components, Packaging and Manufacturing Technology2022

2156

2017

Low-temperature SLID-TSV Interconnects for 3D (MEMS) Packaging

Peer-reviewed
Open access
DOI
10.1109/TCPMT.2025.3528519
2025

Facilitating Small-Pitch Interconnects with Low-Temperature Solid-Liquid Interdiffusion Bonding

Peer-reviewed
Open access
DOI
10.1109/TCPMT.2025.3540665
2025

Complex Permittivity Characterization of Low-loss Slabs Using Time-gating Technique

Peer-reviewed
Open access
DOI
10.1109/TCPMT.2025.3551958
2025

Optical Setup for Laser-Assisted Bonding with Through-Silicon Microscopy Capabilities

Peer-reviewed
Open access
DOI
10.1109/TCPMT.2025.3557118
2025

Comparison and Optimization of SLID Bonding for Die-attach on Various Substrate Types in Power Module Packaging Applications

Peer-reviewed
Open access
DOI
10.1109/TCPMT.2025.3626444
2025

Cryogenic characterization of LTCC material in Millimeter-Wave Frequencies

Peer-reviewed
DOI
10.1109/TCPMT.2024.3400028
2024

Novel low-temperature interconnects for 2.5/3D MEMS integration: demonstration and reliability

Peer-reviewed
Open access
DOI
10.1109/TCPMT.2024.3430061
2024

In-line Vector Modulator Integration in Dielectric-filled Waveguide

Peer-reviewed
Open access
DOI
10.1109/TCPMT.2023.3244865
2023

Machine Vision System Utilizing Black Silicon CMOS Camera for Through-Silicon Alignment

Peer-reviewed
Open access
DOI
10.1109/TCPMT.2022.3225051
2022